000 07850nam a2201537 i 4500
001 5270476
003 IEEE
005 20200421114115.0
006 m o d
007 cr |n|||||||||
008 100317t20152001nyua ob 001 0 eng d
020 _a9780470544051
_qelectronic
020 _z9780780360259
_qprint
020 _z0470544058
_qelectronic
024 7 _a10.1109/9780470544051
_2doi
035 _a(CaBNVSL)mat05270476
035 _a(IDAMS)0b000064810cbddb
040 _aCaBNVSL
_beng
_erda
_cCaBNVSL
_dCaBNVSL
050 4 _aTK7870.23
_b.A253 2001eb
082 0 4 _a620/.00452
_222
082 0 4 _a658.5/7
_222
245 0 0 _aAccelerated stress testing handbook :
_bguide for achieving quality products /
_cedited by H. Anthony Chan, Paul J. Englert.
264 1 _aNew York :
_bIEEE Press,
_cc2001.
264 2 _a[Piscataqay, New Jersey] :
_bIEEE Xplore,
_c[2009]
300 _a1 PDF (xxii, 372 pages) :
_billustrations.
336 _atext
_2rdacontent
337 _aelectronic
_2isbdmedia
338 _aonline resource
_2rdacarrier
504 _aIncludes bibliographical references (p. 340-363) and index.
505 0 _aForeword (F. Ianna). Preface. Acknowledgments. OVERVIEW. Introduction (H. Chan and P. Englert). Principles of Stress Testing (H. Chan and P. Englert). PROCESS AND GUIDELINES. Stress Testing Program: Generic Processes (H. Chan and P. Englert). Stress Testing Program Subprocesses (H. Chan and P. Englert). Guidelines for Design and Manufacturing Stress Testing (H. Chan and P. Englert). THEORY. Economic and Optimization (H. Chan and P. Englert). Reliability Growth (C. Seusy). Overview of the Failure Analysis Process for Electrical Components (G. Pfeiffer). EQUIPMENT AND TECHNIQUES. Accelerated Stress Testing Equipment and Techniques (C. Felkins). Vibration and Shock Inputs Identify Some Failure Modes (W. Tustin). Relative Effectiveness of Thermal Cycling Versus Burn-In (K. Lo and F. LoVasco). Accelerated Qualification of Electronic Assemblies Under Combined Temperature Cycling and Vibration Environments: Is Miner's Hypothesis Valid (K. Upadhyayula and A. Dasgupta)? Liquid Environmental Stress Testing (LEST) (P. Englert). Safety Qualification of Stress Testing (S. Rajaram). BEST PRACTICES CASE STUDIES IN COMPUTER, COMMUNICATIONS, AND OTHER INDUSTRIES. Production Ast with Computers Using the Taguchi Method (D. Pachuki). Design Ast with Vendor Electronics (C. Schinner). Design and Production Ast with Power Supplies (D. Dalland). Design and Production Ast with Computers (E. Kyser). Qualifications and Production Sampling Ast with Printed Circuit Boards (H. McLean). Manufacturing Ast with Telecommunication Products (T. Parker and G. Harrison). Production Ast with Computer Disks. Benchmarking (H. Malec). Glossary of Stress Testing Terminology. Bibliography. Index. Epilogue. About the Editors.
506 1 _aRestricted to subscribers or individual electronic text purchasers.
520 _aAs we move closer to a genuinely global economy, the pressure to develop highly reliable products on ever-tighter schedules will increase. Part of a designer's "toolbox" for achieving product reliability in a compressed time frame should be a set of best practices for utilizing accelerated stress testing (AST). The Accelerated Stress Testing Handbook delineates a core set of AST practices as part of an overall methodology for enhancing hardware product reliability. The techniques presented will teach readers to identify design deficiencies and problems with component quality or manufacturing processes early in the product's life, and then to take corrective action as quickly as possible. A wide array of case studies gleaned from leading practitioners of AST supplement the theory and methodology, which will provide the reader with a more concrete idea of how AST truly enhances quality in a reduced time frame. Important topics covered include: . Theoretical basis for AST. General AST best practices. AST design and manufacturing processes. AST equipment and techniques. AST process safety qualification In this handbook, AST cases studies demonstrate thermal, vibration, electrical, and liquid stress application; failure mode analysis; and corrective action techniques. Individuals who would be interested in this book include: reliability engineers and researchers, mechanical and electrical engineers, those involved with all facets of electronics and telecommunications product design and manufacturing, and people responsible for implementing quality and process improvement programs.
530 _aAlso available in print.
538 _aMode of access: World Wide Web
588 _aDescription based on PDF viewed 12/21/2015.
650 0 _aElectronic apparatus and appliances
_xTesting.
650 0 _aElectronic apparatus and appliances
_xReliability.
650 0 _aEnvironmental testing.
655 0 _aElectronic books.
695 _aAcceleration
695 _aApproximation methods
695 _aAssembly
695 _aAvailability
695 _aBarium
695 _aBenchmark testing
695 _aBibliographies
695 _aBiographies
695 _aBooks
695 _aBusiness
695 _aCentral Processing Unit
695 _aCompanies
695 _aComputer aided software engineering
695 _aComputers
695 _aContainers
695 _aCooling
695 _aDatabases
695 _aDegradation
695 _aEconomics
695 _aElectric shock
695 _aElectronics industry
695 _aEquations
695 _aFailure analysis
695 _aFatigue
695 _aFixtures
695 _aGuidelines
695 _aIndexes
695 _aIndustries
695 _aIntegrated circuit interconnections
695 _aInternet
695 _aLead
695 _aLife estimation
695 _aLiquids
695 _aLoad modeling
695 _aManufacturing
695 _aManufacturing processes
695 _aMaterials
695 _aMathematical model
695 _aMonitoring
695 _aNitrogen
695 _aOptical fibers
695 _aOptimization
695 _aPediatrics
695 _aPortfolios
695 _aPower supplies
695 _aPower system reliability
695 _aPrincipal component analysis
695 _aProbability distribution
695 _aProduct development
695 _aProduction
695 _aProduction facilities
695 _aPrototypes
695 _aQualifications
695 _aRandom access memory
695 _aReliability
695 _aReliability engineering
695 _aReliability theory
695 _aResonant frequency
695 _aRobustness
695 _aSafety
695 _aScanning electron microscopy
695 _aSchedules
695 _aSections
695 _aSensors
695 _aSoftware
695 _aSoldering
695 _aSprings
695 _aStress
695 _aStress measurement
695 _aSurface treatment
695 _aTemperature control
695 _aTemperature distribution
695 _aTemperature measurement
695 _aTemperature sensors
695 _aTerminology
695 _aTest equipment
695 _aTesting
695 _aThermal analysis
695 _aThermal loading
695 _aThermal stresses
695 _aThroughput
695 _aTransient analysis
695 _aVibration measurement
695 _aVibrations
700 1 _aChan, H. Anthony,
_d1952-
700 1 _aEnglert, Paul J,
_d1960-
710 2 _aJohn Wiley & Sons,
_epublisher.
710 2 _aIEEE Xplore (Online service),
_edistributor.
776 0 8 _iPrint version:
_z9780780360259
856 4 2 _3Abstract with links to resource
_uhttp://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5270476
942 _cEBK
999 _c59526
_d59526