<![CDATA[Central Library Search for 'au:"Elfadel, Ibrahim (Abe) M."']]>

<![CDATA[Central Library Search for 'au:"Elfadel, Ibrahim (Abe) M."']]> https://opac.l1.nitk.ac.in/cgi-bin/koha/opac-search.pl?q=ccl=au%3A%22Elfadel%2C%20Ibrahim%20%28Abe%29%20M.%22&format=rss2 4 0 50 3D Stacked Chips ISBN 9783319204819 https://opac.l1.nitk.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=55340

. XXIII, 339 p. 238 illus., 157 illus. in color. 9783319204819

Place Hold on 3D Stacked Chips

]]> https://opac.l1.nitk.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=55340 The IoT Physical Layer ISBN 9783319931005 https://opac.l1.nitk.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=76115

. XXXIII, 382 p. 259 illus., 229 illus. in color. 9783319931005

Place Hold on The IoT Physical Layer

]]> https://opac.l1.nitk.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=76115 Machine Learning in VLSI Computer-Aided Design ISBN 9783030046668 https://opac.l1.nitk.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=76809

. XXII, 694 p. 341 illus., 275 illus. in color. 9783030046668

Place Hold on Machine Learning in VLSI Computer-Aided Design

]]> https://opac.l1.nitk.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=76809 3D Stacked Chips ISBN 9783319204819 https://opac.l1.nitk.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=79082

. XXIII, 339 p. 238 illus., 157 illus. in color. 9783319204819

Place Hold on 3D Stacked Chips

]]> https://opac.l1.nitk.ac.in/cgi-bin/koha/opac-detail.pl?biblionumber=79082