Advances in chemical mechanical planarization (CMP) / (Record no. 82630)
[ view plain ]
| 000 -LEADER | |
|---|---|
| fixed length control field | 05494cam a2200589 i 4500 |
| 001 - CONTROL NUMBER | |
| control field | on1269213012 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | OCoLC |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20230516165952.0 |
| 006 - FIXED-LENGTH DATA ELEMENTS--ADDITIONAL MATERIAL CHARACTERISTICS | |
| fixed length control field | m o d |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION | |
| fixed length control field | cr cnu---unuuu |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 210927s2022 enk ob 001 0 eng d |
| 040 ## - CATALOGING SOURCE | |
| Original cataloging agency | OPELS |
| Language of cataloging | eng |
| Description conventions | rda |
| -- | pn |
| Transcribing agency | OPELS |
| Modifying agency | OCLCO |
| -- | OCLCF |
| -- | UKAHL |
| -- | YDX |
| -- | YDXIT |
| -- | SOE |
| -- | UKMGB |
| -- | OCLCQ |
| -- | OCLCO |
| -- | K6U |
| -- | OCLCQ |
| 015 ## - NATIONAL BIBLIOGRAPHY NUMBER | |
| National bibliography number | GBC1J7403 |
| Source | bnb |
| 016 7# - NATIONAL BIBLIOGRAPHIC AGENCY CONTROL NUMBER | |
| Record control number | 020367501 |
| Source | Uk |
| 019 ## - | |
| -- | 1268206603 |
| -- | 1277058082 |
| -- | 1287281908 |
| -- | 1287874415 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9780128218198 |
| Qualifying information | (electronic book) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 0128218193 |
| Qualifying information | (electronic book) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| Canceled/invalid ISBN | 9780128217917 |
| Qualifying information | (print) |
| 035 ## - SYSTEM CONTROL NUMBER | |
| System control number | (OCoLC)1269213012 |
| Canceled/invalid control number | (OCoLC)1268206603 |
| -- | (OCoLC)1277058082 |
| -- | (OCoLC)1287281908 |
| -- | (OCoLC)1287874415 |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER | |
| Classification number | TK7874.84 |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TEC |
| Subject category code subdivision | 008000 |
| Source | bisacsh |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TEC |
| Subject category code subdivision | 008060 |
| Source | bisacsh |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TEC |
| Subject category code subdivision | 008070 |
| Source | bisacsh |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TEC |
| Subject category code subdivision | 030000 |
| Source | bisacsh |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TGM |
| Source | bicssc |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TTB |
| Source | bicssc |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.38152 |
| Edition number | 23 |
| 245 00 - TITLE STATEMENT | |
| Title | Advances in chemical mechanical planarization (CMP) / |
| Statement of responsibility, etc. | edited by Suryadevara Babu. |
| 250 ## - EDITION STATEMENT | |
| Edition statement | Second edition. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE | |
| Place of production, publication, distribution, manufacture | Duxford, United Kingsom : |
| Name of producer, publisher, distributor, manufacturer | Woodhead Publishing, |
| Date of production, publication, distribution, manufacture, or copyright notice | 2022. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 1 online resource |
| 336 ## - CONTENT TYPE | |
| Content type term | text |
| Content type code | txt |
| Source | rdacontent |
| 337 ## - MEDIA TYPE | |
| Media type term | computer |
| Media type code | c |
| Source | rdamedia |
| 338 ## - CARRIER TYPE | |
| Carrier type term | online resource |
| Carrier type code | cr |
| Source | rdacarrier |
| 490 1# - SERIES STATEMENT | |
| Series statement | Woodhead Publishing Series in Electronic and Optical Materials |
| 500 ## - GENERAL NOTE | |
| General note | Includes index. |
| 588 0# - SOURCE OF DESCRIPTION NOTE | |
| Source of description note | Online resource; title from PDF title page (ScienceDirect, viewed September 27, 2021). |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE | |
| Bibliography, etc. note | Includes bibliographical references and index. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc. | Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction.-- |
| Assigning source | Source other than the Library of Congress. |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | <P><b>Part One -- CMP of dielectric and metal films</b></p> <p>1. Chemical and physical mechanisms of dielectric chemical mechanical polishing (CMP)</p> <p>2. Copper chemical mechanical planarization (Cu CMP) challenges in 22 nm back-end-of-line (BEOL) and beyond</p> <p>3. Electrochemical techniques and their applications for CMP of metal films</p> <p>4. Ultra-low-k materials and chemical mechanical planarization (CMP)</p> <p>5. CMP processing of high mobility channel materials -- alternatives to Sis</p> <p>6. Multiscale modeling of chemical mechanical planarization (CMP)</p> <p>7. Polishing of SiC films</p> <p>8. Chemical and physical mechanisms of CMP of gallium nitride</p> <p>9. Abrasive-free and ultra-low abrasive chemical mechanical polishing (CMP) processes</p> <p>10. Transient copper removal rate phenomena with implications for polishing mechanisms</p> <p>11. Environmental aspects of planarization processes </p><b> <p>Part Two -- Consumables and process control for improved CMP</p></b> <p>12. Preparation and characterization of slurry for CMP</p> <p>13. Chemical metrology methods for CMP quality</p> <p>14. Diamond disc pad conditioning in chemical mechanical polishing</p> <p>15. Characterization of surface processes during oxide CMP by in situ FTIR spectroscopy</p> <p>16. Chemical mechanical polishing (CMP) removal rate uniformity and role of carrier parameters</p> <p>17. Approaches to defect characterization, mitigation and reduction</p> <p>18. Challenges and solutions for post-CMP cleaning at device and interconnect levels</p> <p>19. Applications of chemical mechanical planarization (CMP) to More than Moore devices</p> <p>20. CMP for phase change materials</p> <p>21. CMP pads and their performance</p> <p>22. Latest developments in the understanding of PVA brush related issues during post CMP (pCMP) cleaning</p> |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Chemical mechanical planarization. |
| 9 (RLIN) | 69539 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Semiconductors |
| General subdivision | Materials. |
| 9 (RLIN) | 6444 |
| 650 #6 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Planarisation chimicom�ecanique. |
| Authority record control number or standard number | (CaQQLa)000264170 |
| 9 (RLIN) | 69540 |
| 650 #6 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Semi-conducteurs |
| Authority record control number or standard number | (CaQQLa)201-0318258 |
| General subdivision | Mat�eriaux. |
| Authority record control number or standard number | (CaQQLa)201-0379329 |
| 9 (RLIN) | 69541 |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Chemical mechanical planarization. |
| Source of heading or term | fast |
| Authority record control number or standard number | (OCoLC)fst01742691 |
| 9 (RLIN) | 69539 |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Semiconductors |
| General subdivision | Materials. |
| Source of heading or term | fast |
| Authority record control number or standard number | (OCoLC)fst01112237 |
| 9 (RLIN) | 6444 |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Babu, S. V., |
| Relator term | editor. |
| 9 (RLIN) | 69542 |
| 776 0# - ADDITIONAL PHYSICAL FORM ENTRY | |
| International Standard Book Number | 012821791X |
| 830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE | |
| Uniform title | Woodhead Publishing series in electronic and optical materials. |
| 9 (RLIN) | 69543 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Materials specified | ScienceDirect |
| Uniform Resource Identifier | <a href="https://www.sciencedirect.com/science/book/9780128217917">https://www.sciencedirect.com/science/book/9780128217917</a> |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | eBooks |
No items available.