Accelerated stress testing handbook : (Record no. 59526)

000 -LEADER
fixed length control field 07850nam a2201537 i 4500
001 - CONTROL NUMBER
control field 5270476
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20200421114115.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 100317t20152001nyua ob 001 0 eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
ISBN 9780470544051
-- electronic
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
-- print
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
-- electronic
082 04 - CLASSIFICATION NUMBER
Call Number 620/.00452
082 04 - CLASSIFICATION NUMBER
Call Number 658.5/7
245 00 - TITLE STATEMENT
Title Accelerated stress testing handbook :
Sub Title guide for achieving quality products /
300 ## - PHYSICAL DESCRIPTION
Number of Pages 1 PDF (xxii, 372 pages) :
505 0# - FORMATTED CONTENTS NOTE
Remark 2 Foreword (F. Ianna). Preface. Acknowledgments. OVERVIEW. Introduction (H. Chan and P. Englert). Principles of Stress Testing (H. Chan and P. Englert). PROCESS AND GUIDELINES. Stress Testing Program: Generic Processes (H. Chan and P. Englert). Stress Testing Program Subprocesses (H. Chan and P. Englert). Guidelines for Design and Manufacturing Stress Testing (H. Chan and P. Englert). THEORY. Economic and Optimization (H. Chan and P. Englert). Reliability Growth (C. Seusy). Overview of the Failure Analysis Process for Electrical Components (G. Pfeiffer). EQUIPMENT AND TECHNIQUES. Accelerated Stress Testing Equipment and Techniques (C. Felkins). Vibration and Shock Inputs Identify Some Failure Modes (W. Tustin). Relative Effectiveness of Thermal Cycling Versus Burn-In (K. Lo and F. LoVasco). Accelerated Qualification of Electronic Assemblies Under Combined Temperature Cycling and Vibration Environments: Is Miner's Hypothesis Valid (K. Upadhyayula and A. Dasgupta)? Liquid Environmental Stress Testing (LEST) (P. Englert). Safety Qualification of Stress Testing (S. Rajaram). BEST PRACTICES CASE STUDIES IN COMPUTER, COMMUNICATIONS, AND OTHER INDUSTRIES. Production Ast with Computers Using the Taguchi Method (D. Pachuki). Design Ast with Vendor Electronics (C. Schinner). Design and Production Ast with Power Supplies (D. Dalland). Design and Production Ast with Computers (E. Kyser). Qualifications and Production Sampling Ast with Printed Circuit Boards (H. McLean). Manufacturing Ast with Telecommunication Products (T. Parker and G. Harrison). Production Ast with Computer Disks. Benchmarking (H. Malec). Glossary of Stress Testing Terminology. Bibliography. Index. Epilogue. About the Editors.
520 ## - SUMMARY, ETC.
Summary, etc As we move closer to a genuinely global economy, the pressure to develop highly reliable products on ever-tighter schedules will increase. Part of a designer's "toolbox" for achieving product reliability in a compressed time frame should be a set of best practices for utilizing accelerated stress testing (AST). The Accelerated Stress Testing Handbook delineates a core set of AST practices as part of an overall methodology for enhancing hardware product reliability. The techniques presented will teach readers to identify design deficiencies and problems with component quality or manufacturing processes early in the product's life, and then to take corrective action as quickly as possible. A wide array of case studies gleaned from leading practitioners of AST supplement the theory and methodology, which will provide the reader with a more concrete idea of how AST truly enhances quality in a reduced time frame. Important topics covered include: . Theoretical basis for AST. General AST best practices. AST design and manufacturing processes. AST equipment and techniques. AST process safety qualification In this handbook, AST cases studies demonstrate thermal, vibration, electrical, and liquid stress application; failure mode analysis; and corrective action techniques. Individuals who would be interested in this book include: reliability engineers and researchers, mechanical and electrical engineers, those involved with all facets of electronics and telecommunications product design and manufacturing, and people responsible for implementing quality and process improvement programs.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
General subdivision Testing.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
General subdivision Reliability.
700 1# - AUTHOR 2
Author 2 Chan, H. Anthony,
700 1# - AUTHOR 2
Author 2 Englert, Paul J,
856 42 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5270476
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type eBooks
264 #1 -
-- New York :
-- IEEE Press,
-- c2001.
264 #2 -
-- [Piscataqay, New Jersey] :
-- IEEE Xplore,
-- [2009]
336 ## -
-- text
-- rdacontent
337 ## -
-- electronic
-- isbdmedia
338 ## -
-- online resource
-- rdacarrier
588 ## -
-- Description based on PDF viewed 12/21/2015.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Electronic apparatus and appliances
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Electronic apparatus and appliances
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Environmental testing.
695 ## -
-- Acceleration
695 ## -
-- Approximation methods
695 ## -
-- Assembly
695 ## -
-- Availability
695 ## -
-- Barium
695 ## -
-- Benchmark testing
695 ## -
-- Bibliographies
695 ## -
-- Biographies
695 ## -
-- Books
695 ## -
-- Business
695 ## -
-- Central Processing Unit
695 ## -
-- Companies
695 ## -
-- Computer aided software engineering
695 ## -
-- Computers
695 ## -
-- Containers
695 ## -
-- Cooling
695 ## -
-- Databases
695 ## -
-- Degradation
695 ## -
-- Economics
695 ## -
-- Electric shock
695 ## -
-- Electronics industry
695 ## -
-- Equations
695 ## -
-- Failure analysis
695 ## -
-- Fatigue
695 ## -
-- Fixtures
695 ## -
-- Guidelines
695 ## -
-- Indexes
695 ## -
-- Industries
695 ## -
-- Integrated circuit interconnections
695 ## -
-- Internet
695 ## -
-- Lead
695 ## -
-- Life estimation
695 ## -
-- Liquids
695 ## -
-- Load modeling
695 ## -
-- Manufacturing
695 ## -
-- Manufacturing processes
695 ## -
-- Materials
695 ## -
-- Mathematical model
695 ## -
-- Monitoring
695 ## -
-- Nitrogen
695 ## -
-- Optical fibers
695 ## -
-- Optimization
695 ## -
-- Pediatrics
695 ## -
-- Portfolios
695 ## -
-- Power supplies
695 ## -
-- Power system reliability
695 ## -
-- Principal component analysis
695 ## -
-- Probability distribution
695 ## -
-- Product development
695 ## -
-- Production
695 ## -
-- Production facilities
695 ## -
-- Prototypes
695 ## -
-- Qualifications
695 ## -
-- Random access memory
695 ## -
-- Reliability
695 ## -
-- Reliability engineering
695 ## -
-- Reliability theory
695 ## -
-- Resonant frequency
695 ## -
-- Robustness
695 ## -
-- Safety
695 ## -
-- Scanning electron microscopy
695 ## -
-- Schedules
695 ## -
-- Sections
695 ## -
-- Sensors
695 ## -
-- Software
695 ## -
-- Soldering
695 ## -
-- Springs
695 ## -
-- Stress
695 ## -
-- Stress measurement
695 ## -
-- Surface treatment
695 ## -
-- Temperature control
695 ## -
-- Temperature distribution
695 ## -
-- Temperature measurement
695 ## -
-- Temperature sensors
695 ## -
-- Terminology
695 ## -
-- Test equipment
695 ## -
-- Testing
695 ## -
-- Thermal analysis
695 ## -
-- Thermal loading
695 ## -
-- Thermal stresses
695 ## -
-- Throughput
695 ## -
-- Transient analysis
695 ## -
-- Vibration measurement
695 ## -
-- Vibrations

No items available.