3D Stacked Chips (Record no. 55340)

000 -LEADER
fixed length control field 03765nam a22004695i 4500
001 - CONTROL NUMBER
control field 978-3-319-20481-9
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20200421111837.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 160511s2016 gw | s |||| 0|eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
ISBN 9783319204819
-- 978-3-319-20481-9
082 04 - CLASSIFICATION NUMBER
Call Number 621.3815
245 10 - TITLE STATEMENT
Title 3D Stacked Chips
Sub Title From Emerging Processes to Heterogeneous Systems /
300 ## - PHYSICAL DESCRIPTION
Number of Pages XXIII, 339 p. 238 illus., 157 illus. in color.
505 0# - FORMATTED CONTENTS NOTE
Remark 2 Introduction to Electrical 3D Integration -- Copper-based TSV - Interposer -- Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization -- Energy Efficient Electrical Intra-Chip Stack Communication -- Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks -- Energy Efficient Communications Employing 1-Bit Quantization at the Receiver -- 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications -- Accurate Temperature Measurement for 3D Thermal Management -- EDA Environments for 3D Chip Stacks -- Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias -- Introduction to Optical Inter- and Intraconnects -- Optical Through-Silicon Vias -- Integrated Optical Devices for 3D Photonic Transceivers -- Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators -- Athermal photonic circuits for optical on-chip interconnects -- Integrated Circuits for 3D Photonic Transceivers -- Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.-.
520 ## - SUMMARY, ETC.
Summary, etc This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.  The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.   •Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systems; •Explains the use of wireless 3D integration to improve 3D IC reliability and yield; •Describes techniques for monitoring and mitigating thermal behavior in 3D ICs; •Includes discussion of 3D integration of high-density power sources and novel NVM.
700 1# - AUTHOR 2
Author 2 Elfadel, Ibrahim (Abe) M.
700 1# - AUTHOR 2
Author 2 Fettweis, Gerhard.
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier http://dx.doi.org/10.1007/978-3-319-20481-9
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type eBooks
264 #1 -
-- Cham :
-- Springer International Publishing :
-- Imprint: Springer,
-- 2016.
336 ## -
-- text
-- txt
-- rdacontent
337 ## -
-- computer
-- c
-- rdamedia
338 ## -
-- online resource
-- cr
-- rdacarrier
347 ## -
-- text file
-- PDF
-- rda
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Engineering.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Microprocessors.
650 #0 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Electronic circuits.
650 14 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Engineering.
650 24 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Circuits and Systems.
650 24 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Electronic Circuits and Devices.
650 24 - SUBJECT ADDED ENTRY--SUBJECT 1
-- Processor Architectures.
912 ## -
-- ZDB-2-ENG

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